i ntegrated c ircuits d ivision linear optocoupler www.ixysic.com ds-LOC111-r07 1 LOC111 e 3 pb part number description LOC111 8-pin dip (50/tube) LOC111p 8-pin flatpack (50/tube) LOC111ptr 8-pin flatpack (1000/reel) LOC111s 8-pin surface mount (50/tube) LOC111str 8-pin surface mount (1000/reel) applications features description ordering information pin configuration ? modem transformer replacement with no insertion loss ? digital telephone isolation ? power supply feedback voltage/current ? medical sensor isolation ? audio signal interfacing ? isolation of process control transducers ? 0.01% servo linearity ? thd -87db typical ? wide bandwidth (>200khz) ? couples analog and digital signals ? high gain stability ? low input/output capacitance ? low power consumption ? 8-pin flatpack or dip package (pcmcia compatible) ? machine insertable, wave solderable ? surface mount and tape & reel versions available ? vde compatible the LOC111 single linear optocoupler features an infrared led optically coupled with two photodiodes. one feedback (input) photodiode is used to generate a control signal that provides a servomechanism to the led drive current, thus compensating for the led's nonlinear time and temperature characteristics. the other (output) photodiode provides an output signal that is linear with respect to the servo led current. the product features wide bandwidth, high input to output isolation, and excellent servo linearity. approvals k3 sorted bins bin d = 0.733 - 0.805 bin e = 0.806 - 0.886 bin f = 0.887 - 0.974 bin g = 0.975 - 1.072 - led + led c1 a1 n/c n/c c2 a2 1 2 3 4 8 7 6 5 ? the LOC111 will be shipped using bins available at date of order. any bin (d - g) can be shipped. each tube or reel will contain one k3-sorted bin. each device will be marked with the designated bin. parameter rating units led operating range 2-10 ma k3, transfer gain 0.733-1.072 - isolation, input to output 3750 v rms ? ul recognized component: file e76270 ? csa certified component: certificate 1175739 ? certified to: iec60950-1: 2005 en60950-1: 2006 tuv certificate b 09 07 49410 006
i ntegrated c ircuits d ivision www.ixysic.com 2 r07 LOC111 absolute maximum ratings are stress ratings. stresses in excess of these ratings can cause permanent damage to the device. functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. absolute maximum ratings @ 25oc parameter ratings units reverse led voltage 5 v input control current 100 ma peak (10ms) 1 a input power dissipation 1 150 mw total package dissipation 2 500 mw isolation voltage, input to output 3750 v rms operational temperature -40 to +85 c storage temperature -40 to +125 c 1 derate linearly 1.33 mw / c 2 derate linearly 6.67 mw / c electrical characteristics @ 25oc parameter conditions symbol min typ max units input characteristics led voltage drop i f = 2 - 10ma v f 0.9 1.2 1.4 v reverse led current v r = 5v i r --10 ? a coupler/detector characteristics dark current i f =0ma, v c1-a1 =v c2-a2 =15v i d - 1 25 na k1, servo gain (i c1 /i f ) i f =2 - 10ma, v c1-a1 =v c2-a2 =15v k1 0.008 - 0.030 - k2, forward gain (i c2 /i f ) k2 0.006 - 0.030 - k3, transfer gain (k2/k1=i c2 /i c1 ) k3 0.733 1 1.072 - ? k3, transfer gain linearity (non-servoed) i f =2 - 10ma ? k3 - - 1 % k3 temperature coefficient i f =2 - 10ma, v c1-a1 =v c2-a2 = 5v ? k3/ ? t - 0.005 - % / oc common-mode rejection ratio v=20v p-p , r l =2k ? , f=100hz cmrr - 130 - db total harmonic distortion f 0 =350hz, 0dbm thd -96 -87 -80 db frequency response 1 photoconductive configuration f -3db - 200 - khz photovoltaic configuration 40 input/output capacitance - c i/o -3-pf 1 refer to application note, an-107, for LOC111 configurations.
i ntegrated c ircuits d ivision LOC111 www.ixysic.com 3 r07 *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written speci? cations, please contact our application department. led forward voltage (v) 1.0 1.1 1.2 1.3 1.4 1.5 led current (ma) 0 10 20 30 40 50 60 led forward current vs. led forward voltage led forward voltage (v) 1.0 1.1 1.2 1.3 1.4 1.5 led current (ma) 0.01 0.1 1 10 100 led forward current vs. led forward voltage temperature (oc) -40 -20 0 20 40 60 80 100 led forward voltage drop (v) 1.0 1.1 1.2 1.3 1.4 1.5 1.6 typical led forward voltage drop vs. temperature i f =5ma i f =2ma i f =1ma i f =50ma i f =20ma i f =10ma led current (ma) 0 2 4 6 8 10 12 servo gain 0.000 0.004 0.008 0.012 0.016 servo gain vs. led current & temperature 0oc 25oc 50oc 70oc 85oc led current (ma) 024681012 servo-photocurrent ( p a) 0 20 40 60 80 100 120 140 servo-photocurrent vs. led current & temperature 0oc 25oc 50oc 70oc 85oc led current (ma) 024681012 normalized servo-photocurrent 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 normalized servo-photocurrent vs. led current & temperature 0oc 25oc 50oc 70oc 85oc performance data @25oc (unless otherwise noted)*
i ntegrated c ircuits d ivision www.ixysic.com 4 r07 LOC111 manufacturing information moisture sensitivity all plastic encapsulated semiconductor packages are susceptible to moisture ingression. ixys integrated circuits division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, ipc/jedec j-std-020 , in force at the time of product evaluation. we test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. this product carries a moisture sensitivity level (msl) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard ipc/jedec j-std-033 . device moisture sensitivity level (msl) rating LOC111 / LOC111p / LOC111s msl 1 esd sensitivity this product is esd sensitive , and should be handled according to the industry standard jesd-625 . reflow profile this product has a maximum body temperature and time rating as shown below. all other guidelines of j-std-020 must be observed. device maximum temperature x time LOC111 / LOC111s 250oc for 30 seconds LOC111p 260oc for 30 seconds board wash ixys integrated circuits division recommends the use of no-clean flux formulations. however, board washing to remove flux residue is acceptable. since ixys integrated circuits division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. chlorine- or fluorine-based solvents or fluxes should not be used. cleaning methods that employ ultrasonic energy should not be used. e 3 pb
i ntegrated c ircuits d ivision LOC111 www.ixysic.com 5 r07 dimensions mm (inches) pcb hole pattern 2.540 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) 9.144 0.508 (0.360 0.020) 0.457 0.076 (0.018 0.003) 9.652 0.381 (0.380 0.015) 7.239 typ. (0.285) 7.620 0.254 (0.300 0.010) 4.064 typ (0.160) 0.813 0.102 (0.032 0.004) 8-0.800 dia. (8-0.031 dia.) 2.540 0.127 (0.100 0.005) 7.620 0.127 (0.300 0.005) 7.620 0.127 (0.300 0.005) 6.350 0.127 (0.250 0.005) 3.302 0.051 (0.130 0.002) pin 1 0.254 0.0127 (0.010 0.0005) dimensions mm (inches) pcb land pattern 9.398 0.127 (0.370 0.005) 6.350 0.127 (0.250 0.005) 2.540 0.127 (0.100 0.005) 7.620 0.254 (0.300 0.010) 0 min / 0.102 max (0 min / 0.004 max) 2.286 max. (0.090 max.) 0.203 0.013 (0.008 0.0005) 0.635 0.127 (0.025 0.005) 9.652 0.381 (0.380 0.015) 0.457 0.076 (0.018 0.003) 2.159 0.025 (0.085 0.001) 2.54 (0.10) 8.70 (0.3425) 1.55 (0.0610) 0.65 (0.0255) 0.864 0.120 (0.034 0.004) pin 1 dimensions mm (inches) pcb land pattern 2.540 0.127 (0.100 0.005) 9.652 0.381 (0.380 0.015) 6.350 0.127 (0.250 0.005) 9.525 0.254 (0.375 0.010) 0.457 0.076 (0.018 0.003) 0.813 0.102 (0.032 0.004) 4.445 0.127 (0.175 0.005) 7.620 0.254 (0.300 0.010) 0.635 0.127 (0.025 0.005) 0.254 0.0127 (0.010 0.0005) 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 3.302 0.051 (0.130 0.002) pin 1 LOC111 LOC111p LOC111s mechanical dimensions
i ntegrated c ircuits d ivision for additional information please visit our website at: www.ixysic.com 6 LOC111 ixys integrated circuits division makes no representations or warranties with respect to the accuracy or completeness of the co ntents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit patent licenses nor indemnity a re expressed or implied. except as set forth in ixys integrated circuits division?s standard terms and conditions of sale, ixys integrated circuits division assumes no liability whatsoever, a nd disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infri ngement of any intellectual property right. the products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of ixys integrated circuits division?s product may resul t in direct physical harm, injury, or death to a person or severe property or environmental damage. ixys integrated circuits division reserves the right to discontinue or make changes to its p roducts at any time without notice. specification: ds-LOC111-r07 ?copyright 2012, ixys integrated circuits division all rights reserved. printed in usa. 12/19/2012 dimensions mm (inches) notes: 1. all dimensions carry tolerances of eia standard 481-2 2. the tape complies with all notes for constant dimensions listed on page 5 of eia-481-2 embossment embossed carrier top cover tape thickness 0.102 max. (0.004 max.) 330.2 dia. (13.00 dia.) user direction of feed p = 12.00 (0.472) w = 16.00 (0.63) bo = 10.30 (0.406) ao = 10.30 (0.406) k 1 = 2.00 (0.079) k 0 = 2.70 (0.106) 7.50 (0.295) 2.00 (0.079) 4.00 (0.157) dimensions mm (inches) user direction of feed notes: 1. dimensions carry tolerances of eia standard 481-2 2. tape complies with all notes for constant dimensions listed on page 5 of eia-481-2 embossment embossed carrier top cover tape thickness 0.102 max. (0.004 max.) 330.2 dia. (13.00 dia.) k 1 =4.20 (0.165) 0 k =4.90 (0.193) p=12.00 (0.472) w=16.00 (0.63) bo=10.30 (0.406) ao=10.30 (0.406) LOC111ptr tape & reel LOC111str tape & reel
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